| Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging Contributor(s): Wei, Xing-Chang (Author) |
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ISBN: 0367573660 ISBN-13: 9780367573669 Publisher: CRC Press OUR PRICE: $56.95 Product Type: Paperback - Other Formats Published: June 2020 |
| Additional Information |
| BISAC Categories: - Computers | Microprocessors - Technology & Engineering | Electronics - Circuits - General - Technology & Engineering | Microwaves |
| Dewey: 621.381 |
| Physical Information: 0.9" H x 6.1" W x 9.1" (1.19 lbs) 322 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications. |