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Adhesion in Microelectronics
Contributor(s): Mittal, K. L. (Author), Ahsan, Tanweer (Author)
ISBN: 1118831330     ISBN-13: 9781118831335
Publisher: Wiley-Scrivener
OUR PRICE:   $214.65  
Product Type: Hardcover - Other Formats
Published: September 2014
Qty:
Temporarily out of stock - Will ship within 2 to 5 weeks
Additional Information
BISAC Categories:
- Technology & Engineering | Materials Science - Metals & Alloys
- Technology & Engineering | Electronics - General
Dewey: 621.381
LCCN: 2014029765
Series: Adhesion and Adhesives: Fundamental and Applied Aspects
Physical Information: 1" H x 6.1" W x 9.3" (1.40 lbs) 368 pages
 
Descriptions, Reviews, Etc.
Publisher Description:

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;

  • Various theories or mechanisms of adhesion
  • Surface (physical or chemical) characterization of materials as it pertains to adhesion
  • Surface cleaning as it pertains to adhesion
  • Ways to improve adhesion
  • Unraveling of interfacial interactions using an array of pertinent techniques
  • Characterization of interfaces / interphases
  • Polymer-polymer adhesion
  • Metal-polymer adhesion (metallized polymers)
  • Polymer adhesion to various substrates
  • Adhesion of thin films
  • Adhesion of underfills
  • Adhesion of molding compounds
  • Adhesion of different dielectric materials
  • Delamination and reliability issues in packaged devices
  • Interface mechanics and crack propagation
  • Adhesion measurement of thin films and coatings