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Advanced Metallization and Interconnect Systems for ULSI Applications in 1996: Volume 12
Contributor(s): Havemann, Robert (Editor), Schmitz, John (Editor), Komiyama, Hiroshi (Editor)
ISBN: 1558993851     ISBN-13: 9781558993853
Publisher: Materials Research Society
OUR PRICE:   $28.49  
Product Type: Hardcover
Published: February 2000
Qty:
Temporarily out of stock - Will ship within 2 to 5 weeks
Additional Information
BISAC Categories:
- Computers | Logic Design
- Technology & Engineering | Materials Science - General
Dewey: 621.395
LCCN: 97175564
Series: Materials Research Society Conference Proceedings
Physical Information: 1.5" H x 6.2" W x 9.2" (2.20 lbs) 608 pages
 
Descriptions, Reviews, Etc.
Publisher Description:
The scope of this volume has gradually expanded from its initial focus on metal deposition to include all aspects of multilevel interconnect fabrication including conductors, dielectrics, planarization, integration and reliability. At the same time, it has also retained its original emphasis on leading-edge material, interface and process science that has made the series so unique. The volume features a keynote address on "Scaling High-Performance Interconnects".