Advanced Metallization and Interconnect Systems for ULSI Applications in 1996: Volume 12 Contributor(s): Havemann, Robert (Editor), Schmitz, John (Editor), Komiyama, Hiroshi (Editor) |
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ISBN: 1558993851 ISBN-13: 9781558993853 Publisher: Materials Research Society OUR PRICE: $28.49 Product Type: Hardcover Published: February 2000 |
Additional Information |
BISAC Categories: - Computers | Logic Design - Technology & Engineering | Materials Science - General |
Dewey: 621.395 |
LCCN: 97175564 |
Series: Materials Research Society Conference Proceedings |
Physical Information: 1.5" H x 6.2" W x 9.2" (2.20 lbs) 608 pages |
Descriptions, Reviews, Etc. |
Publisher Description: The scope of this volume has gradually expanded from its initial focus on metal deposition to include all aspects of multilevel interconnect fabrication including conductors, dielectrics, planarization, integration and reliability. At the same time, it has also retained its original emphasis on leading-edge material, interface and process science that has made the series so unique. The volume features a keynote address on "Scaling High-Performance Interconnects". |