| Carbon Nanotubes for Interconnects: Process, Design and Applications 2017 Edition Contributor(s): Todri-Sanial, Aida (Editor), Dijon, Jean (Editor), Maffucci, Antonio (Editor) |
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ISBN: 3319297449 ISBN-13: 9783319297446 Publisher: Springer OUR PRICE: $104.49 Product Type: Hardcover - Other Formats Published: July 2016 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electronics - Circuits - General - Computers | Systems Architecture - General - Computers | Hardware - Mainframes & Minicomputers |
| Dewey: 004.1 |
| Physical Information: 0.81" H x 6.14" W x 9.21" (1.46 lbs) 333 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. |