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  (7 items found)
Title Author / Artist Prod Type ISBN/ISBN-13
or UPC		 Pub
Date		 Price
3D IC Integration and PackagingLau, John H.Hardcover0071848061 /
9780071848060		08/2015$207.10
Fan-Out Wafer-Level Packaging 2018 Edition Lau, John H.Hardcover9811088837 /
9789811088834		04/2018$151.99
Fan-Out Wafer-Level Packaging Softcover Repri Edition Lau, John H.Paperback9811342660 /
9789811342660		12/2018$104.49
Handbook of Tape Automated Bonding 1992 Edition Lau, John H.Hardcover0442004273 /
9780442004279		01/1992$208.99
Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)Lau, John H.Hardcover0071753796 /
9780071753791		12/2010$138.70
Solder Joint Reliability: Theory and Applications 1991 Edition Lau, John H.Hardcover0442002602 /
9780442002602		05/1991$208.99
Through-Silicon Vias for 3D IntegrationLau, John H.Hardcover0071785140 /
9780071785143		10/2012$170.05
  (7 items found)